Gain insight to improve etch precision, selectivity, and process stability at atomic-scale dimensions.
The next generation of manufacturing will be defined by autonomy and real-time optimization.
Advanced packaging is redefining semiconductor innovation.
Smarter, Faster, and More Precise Process Control
How Digital Twins Are Shaping the Future of Semiconductor Manufacturing.
Advanced packaging not only keeps chips smaller and more efficient but allows for more powerful, versatile systems.
As technology devices get smaller and chips become denser, manufacturers need ways to continue increasing performance while minimizing power consumption and footprint.
FabGuard® FDC from INFICON offers a smart monitoring and notification system designed to ensure clean recipes are executed on time.