Monitors
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Compact deposition monitor built with ModeLock technology to maximize reproducibility and uniformity with the highest thickness accuracy, best measurement resolution, and lowest rate noise
- INFICON ModeLock technology provides the longest crystal life and ensures the most stable, highest resolution rate and thickness measurement available, even at very low rates
- Maximize yield with the best QCM thickness measurement possible
- Single channel rate and thickness monitor without unnecessary added features to compact size and minimize cost
- EtherCAT communications for seamless integration
Compact deposition monitor built with ModeLock technology to maximize reproducibility and uniformity with the highest thickness accuracy, best measurement resolution, and lowest rate noise
- INFICON ModeLock technology provides the longest crystal life and ensures the most stable, highest resolution rate and thickness measurement available, even at very low rates
- Maximize yield with the best QCM thickness measurement possible
- Single channel rate and thickness monitor without unnecessary added features to compact size and minimize cost
- Ethernet communications for seamless integration
Multi-Film Rate / Thickness Monitor with averaged sensor control capability for large systems or assigned sensor inputs for different materials
- Two measurement channels standard, an additional four optional
- Analog outputs for rate/thickness recording
- High resolution option: 0.03Hz at 10 readings/sec
- RS-232 standard, USB or Ethernet optional
Combines the simplicity of USB connectivity with the accuracy of a precision measurement engine, all in a compact, inexpensive package
- Low cost deposition monitor
- USB connection
- Internal oscillator
- High accuracy at 10 measurements per second
SemiQCM™ SR sensor is one component of a system for precursor monitoring with the other components being an IMM-200 and FabGuard (version 19.12.00-a or higher).
- Real-Time, in situ process monitoring
- Prevent over-etching, identify chamber clean end point
- Identify equipment or process state fault
Real-Time, in situ process monitoring, prevent over-etching, identify chamber clean end point
- Real-Time, in situ process monitoring
- Prevent over-etching, identify chamber clean end point
- Identify equipment or process state fault